Technology - Processing - Chips & SoCs
Processing - Chips & SoCs
Tria Unlocks AI and IoT Potential with Qualcomm-Powered SMARC Modules
March 28, 2025
As edge computing continues to transform with AI in the forefront, having a powerful and energy-efficient module is essential for next-generation applications. Tria's MSC SM2S-QCS6490 SMARC 2.1.1 and MSC SM2S-QCS5430 SMARC 2.1.1 modules are built with Qualcomm technology, delivering high-performance processing, AI acceleration, and extensive connectivity options. Whether for IoT, AI-driven automation, or real-time data processing, these modules are designed to handle the most demanding workloads efficiently.
Processing - Chips & SoCs
Lantronix and Teledyne FLIR Deliver Cutting-Edge AI Vision with Advanced Image Processing
March 26, 2025
Lantronix Inc. is now integrating its Open-Q System-on-Module (SoM) solutions, including hardware and software, with Teledyne FLIR’s thermal infrared (IR) camera modules and Prism embedded software. It is ideal for AI-enabled camera applications in autonomous navigation, drones, surveillance, and robotics.
Processing - Chips & SoCs
Intel, Curtiss-Wright, wolfSSL, and SYSGO Join Forces to Revolutionize Mission-Critical Systems
March 21, 2025
Intel, wolfSSL, Curtiss-Wright, and SYSGO are collaborating to develop next-generation COTS solutions that prioritize safety, security, and innovation in aerospace and industrial industries. By utilizing each company’s strengths, the partnership delivers high performance ruggedized environments that ensure compliance with safety and security standards for mission-critical applications, without requiring specific software, therefore reducing time to market.
Chips & SoCs
SYSGO Enhances Functional Safety and Performance with Intel's 13th Gen Core Processors
March 18, 2025
AMD Unveils 5th Gen AMD EPYC Embedded Processors for Networking, Storage, and Industrial Edge Markets
March 13, 2025
Analog & Power
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Samtec Halo Optical Transceivers to Pave Way for High Performance
March 26, 2025
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Flex Power Modules Unveiled Advanced AI-Optimized Power Solutions at embedded world 2025
March 17, 2025
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embedded world Product Showcase: AMD’s Spartan UltraScale+ FPGA
March 11, 2025
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Selecting Current Sense Transformers for Switched-mode Power Supplies
March 10, 2025
Consumer
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Read Your Brainwaves. For Real
February 03, 2025
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Open Source and Open Standard Synergy: the Tools for Network Innovation
January 17, 2025
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The Logitech Mevo Core 4K camera enables seamless wireless live streaming anywhere with the help of AIROC™ CYW55573 and Murata 2EA Module solution
January 13, 2025
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The Logitech Mevo Core 4K camera enables seamless wireless live streaming anywhere with the help of AIROC™ CYW55573 and Murata 2EA Module solution
January 06, 2025
Networking & 5G
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Bluetooth: New Specifications and New Capabilities
March 18, 2025
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Embedded Executive: The Evolution of a Wireless Standard, LoRa Alliance
February 05, 2025
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Satellite Connectivity for Vehicles: RN941Y Module Brings Reliable Communication to Remote Areas
January 10, 2025
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Ezurio Launches BL54L10 Series - Bluetooth LE + 802.15.4 + NFC Module
November 26, 2024
Processing
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Embedded Executive: Chip Design Is Not Getting Easier | Siemens
April 02, 2025
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Tria Unlocks AI and IoT Potential with Qualcomm-Powered SMARC Modules
March 28, 2025
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Lantronix and Teledyne FLIR Deliver Cutting-Edge AI Vision with Advanced Image Processing
March 26, 2025
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AMD Unveils 5th Gen AMD EPYC Embedded Processors for Networking, Storage, and Industrial Edge Markets
March 13, 2025